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Date filters select awards with transaction activity in the period. Amounts below are lifetime award obligations. IDV values remain separate.
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THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR COMMUNICATION SYSTEMS.Department of Defense$709.1K obligationsEnds Jun 30, 2026
ENGINEERING SERVICES: 2020 MANUFACTURING SUSTAINMENTDepartment of Defense$8.6M obligationsEnds Feb 4, 2021
THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR AIRSPACE SOFTWARE.Department of Defense$3.1M obligationsEnds Apr 30, 2026
ENGINEERING SERVICES, CET 18-828Department of Defense$28.7M obligationsEnds Mar 31, 2021
CET 19-925, 2019 ARMS-FS. THIS TASK WILL ASSESS WAFER PROCESSING OPERATIONS AND FACILITY TOOLS.Department of Defense$8.2M obligationsEnds May 31, 2020
THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONICS CAPABILITY SOLUTIONS FOR ENGINEERING SERVICES TO MITIGATE OBSOLESCENCE OF THE…Department of Defense$9.2M obligationsEnds Jun 30, 2026
CET 18-877, ENGINEERING SERVICESDepartment of Defense$2.7M obligationsEnds May 31, 2020
ENGINEERING SERVICES: THIS TASK WILL ACQUIRE AND INSTALL BUILDING 2 FACILITIES ISO CLASS III CLEAN SPACE FOR A 200 MM WAFER CAPABLE TOOL SET BUILD ACTIVITIES.Department of Defense$40.5M obligationsEnds Dec 31, 2020