Federal contractor profile
MULTILAYER TECHNOLOGY GROUP, INC
UEI HTFLD2QDN177CAGE 0JKV9
Overview
- Legal name
- MULTILAYER TECHNOLOGY GROUP, INC
- Also known as
- JVB ELECTRONICS INC
- Registered location
- IRVING, TX, USA
- Primary NAICS
- 334412 — Bare Printed Circuit Board Manufacturing
- Latest award activity
- May 1, 2026
Read company summary
MULTILAYER TECHNOLOGY GROUP, INC is associated with UEI HTFLD2QDN177 and CAGE 0JKV9 in public federal records. AcornBids currently links 14 prime awards totaling $62.0K in obligations to this entity. Its largest recorded federal customer by obligations is Department of Defense. Its recorded federal awards include work classified as Printed Circuit Assembly (Electronic Assembly) Manufacturing. These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 334412 (Bare Printed Circuit Board Manufacturing). Its public SAM.gov registration lists IRVING, TX, USA.
At a glance
Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Sep 19, 2026. Refresh pending; these totals may be out of date.
Business information
Public SAM.gov registration details.
- Legal name
- MULTILAYER TECHNOLOGY GROUP, INC
- Doing business as
- JVB ELECTRONICS INC
- UEI
- HTFLD2QDN177
- CAGE
- 0JKV9
- Registered address
- 4425 W AIRPORT FWY STE 300, IRVING, TX, 75062, USA
- Registration status
- Active
- Primary NAICS
- 334412 — Bare Printed Circuit Board Manufacturing
- SAM activation
- May 12, 2026
- Initial registration
- Jul 30, 2004
- Entity start
- Oct 16, 1989
- SAM updated
- May 12, 2026
- Registration expires
- May 8, 2027
- Fiscal year end
- Dec 31
- Place of incorporation
- TX, USA
Federal award analysis
Net transaction obligations by federal fiscal period.
Transaction history is not available in the loaded data. Annual funding is not estimated from current award totals.
Recent federal awards
Prime contract awards. Select an award to review its history and source evidence.
| Award / description | Awarding agency | Obligations | Start date | End date |
|---|---|---|---|---|
| N6893626F5174SHIELD PRF GENERATOR DPT-2B REV | Department of Defense | $22.0K | May 1, 2026 | Jun 29, 2026 |
| N6893625FA058ORDERS: N68936-22-D-0032-0112: FENNEC POWER BOARD BB N68936-22-D-0032-0113: ATHENA-RC-08-02 N68936-22-D-0032-0114: ATHENA-OC-16-01 N68936-22-D-0032-0115: ATHENA-SQ-16-02… | Department of Defense | $12.1K | Jul 31, 2025 | Aug 21, 2025 |
| N6893622D0032BOARD FABRICATION AND POPULATION | Department of Defense | $7.4M | Jul 19, 2022 | Not available |
| N6893625FA057ORDERS: N68936-22-D-0032-0107: TMD REVC (ASSEMBLY) N68936-22-D-0032-0109: TMD REVA (ASSEMBLY) N68936-22-D-0032-0110: HIL TG BREAKOUT BOARD (STENCIL) | Department of Defense | $13.4K | May 22, 2025 | Jun 12, 2025 |
| N6893623D0002PRINTED CIRCUIT BOARDS (PCB) | Department of Defense | $7.5M | Mar 16, 2023 | Not available |
| N6893625FA056ORDERS: 0102 - MH_FLTS REV 1A 0103 - GPSSRM BREAKOUT 0104 - 801AS229-2 0105 - 801AS236-2 0108 - CLPSCU-002 REV E4 | Department of Defense | $20.0K | Apr 30, 2025 | Jun 16, 2025 |
| N6893625F0363PRINTED CIRCUIT BOARDS | Department of Defense | $16.9K | Apr 10, 2025 | May 12, 2025 |
| N6893625F0345ELECTRICAL AND ELECTRONIC ASSEMBLIES. GPC TO WAWF | Department of Defense | $3.9K | Apr 8, 2025 | Apr 10, 2025 |
| N6893625F0337FENNEC RFFE CARRIER PCB. GPC TO WAWF | Department of Defense | $4.6K | Apr 1, 2025 | Apr 9, 2025 |
| N6893625F0325ELECTRICAL AND ELECTRONIC ASSEMBLIES. GPC TO WAWF FOR DELIVERED ITEMS | Department of Defense | $3.5K | Apr 1, 2025 | Apr 7, 2025 |
Registration, certifications & contacts
| Registration evidence | Date |
|---|---|
| SAM updated | May 12, 2026 |
| Source loaded | Sep 19, 2026 |
| Initial registration | Jul 30, 2004 |
| Entity start | Oct 16, 1989 |
Registration classifications: Self Certified Small Disadvantaged Business, Small Business. These are separate from the reported certificates above.
| Industry | Reported size status |
|---|---|
| 334412 — Bare Printed Circuit Board Manufacturing | Not reported |
| 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing | Not reported |
| Contact | Role | Published contact methods | Evidence | Source date |
|---|---|---|---|---|
| JAY SAVALIA | Government business | Contact method not published | SAM registration | Not available |
| JAY SAVALIA | Electronic business | Contact method not published | SAM registration | Not available |
Registered industries
- 334412 — Bare Printed Circuit Board Manufacturing
- 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
Registered products and services
- 5963 — Electronic Modules
- 5998 — Electrical and Electronic Assemblies; Boards, Cards, and Associated Hardware
- 5999 — Miscellaneous Electrical and Electronic Components
Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source
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Data coverage and methodology
Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.
No official subaward rows are loaded, so Acorn does not claim known teaming relationships.
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