Federal contractor profile

ENGIN-IC INC

UEI J4LWTAZLK4Q9CAGE 79V91

Active

Overview

Legal name
ENGIN-IC INC
Also known as
ENGIN-IC INC
Registered location
PLANO, TX, USA
Primary NAICS
334413 — Semiconductor and Related Device Manufacturing
Latest award activity
Oct 24, 2025
Read company summary

ENGIN-IC INC is associated with UEI J4LWTAZLK4Q9 and CAGE 79V91 in public federal records. AcornBids currently links 5 prime awards totaling $7.3M in obligations to this entity. Its largest recorded federal customer by obligations is Department of Defense. Its recorded federal awards include work classified as Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology). These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 334413 (Semiconductor and Related Device Manufacturing). Its public SAM.gov registration lists PLANO, TX, USA.

At a glance

Lifetime prime obligations$7.3M
Prime awards5
Awards with future end dates1
Top-agency concentration100.0%

Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Sep 27, 2026. Refresh pending; these totals may be out of date.

Business information

Public SAM.gov registration details.

Legal name
ENGIN-IC INC
Doing business as
ENGIN-IC INC
UEI
J4LWTAZLK4Q9
CAGE
79V91
Registered address
1721 W PLANO PKWY, PLANO, TX, 75075, USA
Registration status
Active
Primary NAICS
334413 — Semiconductor and Related Device Manufacturing
SAM activation
Nov 7, 2025
Initial registration
Dec 2, 2014
Entity start
Oct 16, 2014
SAM updated
Jun 21, 2026
Registration expires
Nov 7, 2026
Fiscal year end
Dec 31
Place of incorporation
TX, USA

View SAM.gov source

Federal award analysis

Net transaction obligations by federal fiscal period.

Transaction history is not available in the loaded data. Annual funding is not estimated from current award totals.

Recent federal awards

Prime contract awards. Select an award to review its history and source evidence.

Award / descriptionAwarding agencyObligationsStart dateEnd date
HQ014717C7412IGF::OT::IGF SBIR/STTR PHASE II R&DDepartment of Defense$999.2KMay 30, 2017May 22, 2019
N6833523C0255SBIR PHASE IIDepartment of Defense$899.8KApr 10, 2023Apr 10, 2025
HQ086020C7402SBIR PHASE II RESEARCH AND DEVELOPMENT: HIGH POWER SOLID STATE AMPLIFIERS AND MODULES FOR COMMUNICATION SYSTEMSDepartment of Defense$2.7MJul 9, 2020Jul 8, 2022
FA865016C1768IGF::OT::IGF KA-BAND EFFICIENT, LINEAR POWER AMPLIFIERS FOR SATCOM GROUND TERMINALSDepartment of Defense$1.5MJul 28, 2016Jan 1, 2025
FA237724CB045ULTRA-WIDEBAND HIGH EFFICIENCY POWER AMPLIFIER FOR MULTIFUNCTION RF SYSTEMSDepartment of Defense$1.2MJul 24, 2024Oct 24, 2026

Upcoming positioning windows

Modeled recompete windows are estimates, not announced solicitations or guarantees.

Registration, certifications & contacts

Registration evidenceDate
SAM updatedJun 21, 2026
Source loadedSep 26, 2026
Initial registrationDec 2, 2014
Entity startOct 16, 2014
IndustryReported size status
334413 — Semiconductor and Related Device ManufacturingNot reported
ContactRolePublished contact methodsEvidenceSource date
CHRIS J ISONGovernment businessContact method not publishedSAM registrationNot available
CHRIS J ISONElectronic businessContact method not publishedSAM registrationNot available
Registered industries
  • 334413 — Semiconductor and Related Device Manufacturing

Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source

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Data coverage and methodology

Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.

No official subaward rows are loaded, so Acorn does not claim known teaming relationships.

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