Federal contractor profile
SUMMIT INTERCONNECT, INC.
UEI J7FCUMUAKLL3CAGE 7PGC5
Active
Overview
- Legal name
- SUMMIT INTERCONNECT, INC.
- Registered location
- IRVINE, CA, USA
- Primary NAICS
- 334412 — Bare Printed Circuit Board Manufacturing
- Latest award activity
- Aug 7, 2026
Read company summary
SUMMIT INTERCONNECT, INC. is associated with UEI J7FCUMUAKLL3 and CAGE 7PGC5 in public federal records. AcornBids currently links 1 prime award totaling $81.2K in obligations to this entity. Its largest recorded federal customer by obligations is National Aeronautics and Space Administration. Its recorded federal awards include work classified as Engineering Services. These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 334412 (Bare Printed Circuit Board Manufacturing). Its public SAM.gov registration lists IRVINE, CA, USA.
At a glance
Lifetime prime obligations$81.2K
Prime awards1
Awards with future end dates1
Top-agency concentration100.0%
Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Sep 27, 2026. Refresh pending; these totals may be out of date.
Business information
Public SAM.gov registration details.
- Legal name
- SUMMIT INTERCONNECT, INC.
- UEI
- J7FCUMUAKLL3
- CAGE
- 7PGC5
- Registered address
- 18101 VON KARMAN AVE STE 1650, IRVINE, CA, 92612, USA
- Registration status
- Active
- Primary NAICS
- 334412 — Bare Printed Circuit Board Manufacturing
- SAM activation
- Jan 22, 2026
- Initial registration
- Aug 1, 2016
- Entity start
- Nov 6, 2019
- SAM updated
- Jan 22, 2026
- Registration expires
- Jan 15, 2027
- Fiscal year end
- Dec 31
- Place of incorporation
- DE, USA
Federal award analysis
Net transaction obligations by federal fiscal period.
Transaction history is not available in the loaded data. Annual funding is not estimated from current award totals.
Recent federal awards
Prime contract awards. Select an award to review its history and source evidence.
| Award / description | Awarding agency | Obligations | Start date | End date |
|---|---|---|---|---|
| 80NSSC26P1195ADAPT GEN III PCB FABRICATION/ASSEMBLY | National Aeronautics and Space Administration | $81.2K | Aug 7, 2026 | Sep 29, 2026 |
Upcoming positioning windows
Modeled recompete windows are estimates, not announced solicitations or guarantees.
Registration, certifications & contacts
| Registration evidence | Date |
|---|---|
| SAM updated | Jan 22, 2026 |
| Source loaded | Sep 26, 2026 |
| Initial registration | Aug 1, 2016 |
| Entity start | Nov 6, 2019 |
| Industry | Reported size status |
|---|---|
| 334412 — Bare Printed Circuit Board Manufacturing | Not reported |
| Contact | Role | Published contact methods | Evidence | Source date |
|---|---|---|---|---|
| JIM PACHECO | Government business | Contact method not published | SAM registration | Not available |
| JIM PACHECO | Electronic business | Contact method not published | SAM registration | Not available |
Registered industries
- 334412 — Bare Printed Circuit Board Manufacturing
Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source
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Data coverage and methodology
Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.
No official subaward rows are loaded, so Acorn does not claim known teaming relationships.
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