Overview
- Legal name
- TRYLENE, INC.
- Registered location
- HOUSTON, TX, USA
- Website
- Company website ↗
- Primary NAICS
- 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Latest award activity
- May 13, 2026
Read company summary
TRYLENE, INC. is associated with UEI PJHANNALLLW6 and CAGE 7M6V9 in public federal records. AcornBids currently links 2 prime awards totaling $12.1K in obligations to this entity. Its largest recorded federal customer by obligations is Department of Defense. Its recorded federal awards include work classified as Printed Circuit Assembly (Electronic Assembly) Manufacturing. These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 334418 (Printed Circuit Assembly (Electronic Assembly) Manufacturing). Its public SAM.gov registration lists HOUSTON, TX, USA.
At a glance
Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Sep 26, 2026. Refresh pending; these totals may be out of date.
Business information
Public SAM.gov registration details.
- Legal name
- TRYLENE, INC.
- UEI
- PJHANNALLLW6
- CAGE
- 7M6V9
- Registered address
- 10650 STANCLIFF RD, HOUSTON, TX, 77099, USA
- Registration status
- Active
- Primary NAICS
- 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
- SAM activation
- Oct 7, 2025
- Initial registration
- May 2, 2016
- Entity start
- Oct 25, 2011
- SAM updated
- Oct 7, 2025
- Registration expires
- Oct 3, 2026
- Fiscal year end
- Dec 31
- Place of incorporation
- TX, USA
Federal award analysis
Net transaction obligations by federal fiscal period.
Transaction history is not available in the loaded data. Annual funding is not estimated from current award totals.
Recent federal awards
Prime contract awards. Select an award to review its history and source evidence.
| Award / description | Awarding agency | Obligations | Start date | End date |
|---|---|---|---|---|
| HQ072726AE006PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS. | Department of Defense | $1.3M | Feb 26, 2026 | Not available |
| HQ072726FE043PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS. | Department of Defense | $12.1K | Mar 6, 2026 | May 1, 2026 |
Registration, certifications & contacts
| Registration evidence | Date |
|---|---|
| SAM updated | Oct 7, 2025 |
| Source loaded | Sep 26, 2026 |
| Initial registration | May 2, 2016 |
| Entity start | Oct 25, 2011 |
Registration classifications: Self Certified Small Disadvantaged Business, Small Business. These are separate from the reported certificates above.
| Industry | Reported size status |
|---|---|
| 332710 — Machine Shops | Not reported |
| 334412 — Bare Printed Circuit Board Manufacturing | Not reported |
| 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing | Not reported |
| 339112 — Surgical and Medical Instrument Manufacturing | Not reported |
| Contact | Role | Published contact methods | Evidence | Source date |
|---|---|---|---|---|
| PARESH JASANI | Government business | Contact method not published | SAM registration | Not available |
| DHRUV PATEL | Alternate government business | Contact method not published | SAM registration | Not available |
| PARESH JASANI | Electronic business | Contact method not published | SAM registration | Not available |
| DHRUV PATEL | Alternate electronic business | Contact method not published | SAM registration | Not available |
Registered industries
- 332710 — Machine Shops
- 334412 — Bare Printed Circuit Board Manufacturing
- 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
- 339112 — Surgical and Medical Instrument Manufacturing
Registered products and services
- 5995 — Cable, Cord, and Wire Assemblies: Communication Equipment
- 5998 — Electrical and Electronic Assemblies; Boards, Cards, and Associated Hardware
Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source
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Data coverage and methodology
Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.
No official subaward rows are loaded, so Acorn does not claim known teaming relationships.
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