Federal contract award

1333ND20PNB680491

PECVD IS A COMMON DEPOSITION TECHNIQUE USED IN THE SEMICONDUCTOR INDUSTRY FOR DEPOSITING INSULATING LAYERS A SYSTEM TO DEPOSIT LOW OPTICAL LOSS FILMS.EVIDENCE TO CONTROL THE STOICHIOMETRY&STRESS OF A FILM INDEPENDENTLY BY USING HELIUM DILUTION

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Commerce
OfficeDEPT OF COMMERCE NIST
NAICS333242 — Semiconductor Machinery Manufacturing
PSC6640 — Laboratory Equipment and Supplies
Parent award / vehicleNot reported
Set-asideNO SET ASIDE USED.
Pricing typeFIRM FIXED PRICE
Obligations$631.3K
Current contract value$631.3K
Potential contract value / ceiling$631.3K
Start dateAug 6, 2020
Current end dateApr 2, 2021
Potential end dateApr 2, 2021
Latest award activityOct 24, 2024
Source loadedAug 15, 2026

Funding and modification history

Showing the latest 1 of 1 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Oct 24, 2024P25001$-0THE PURPOSE OF THIS MODIFICATION IS TO DEOBLIGATE UNLIQUIDATED FUNDS FROM CLIN 0008 AS PART OF THE AWARD CLOSEOUT PROCESS.

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