Federal contract award

1333ND26PNB030070

OU03-FY26-145-NEW CHIPS R&D: BOND STRENGTH TESTER

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Commerce
OfficeDEPT OF COMMERCE NIST
NAICS334513 — Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables
PSC5961 — Semiconductor Devices and Associated Hardware
Parent award / vehicleNot reported
Set-asideSMALL BUSINESS SET ASIDE - TOTAL
Pricing typeFIRM FIXED PRICE
Obligations$85.9K
Current contract value$85.9K
Potential contract value / ceiling$85.9K
Start dateMar 31, 2026
Current end dateJul 3, 2026
Potential end dateJul 3, 2026
Latest award activityMar 31, 2026
Source loadedSep 19, 2026

Funding and modification history

Showing the latest 1 of 1 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Mar 31, 20260$85.9KOU03-FY26-145-NEW CHIPS R&D: BOND STRENGTH TESTER

Buyer contacts from matching notices

Matched on exact award/solicitation identifier and awarding agency. Source dates describe the notice, not current contact verification.

ContactRolePublished contact methodsEvidenceSource date
Tracy RettererContactTracy.retterer@nist.govSourceFeb 3, 2026
Donald CollieContactdonald.collie@nist.govSourceFeb 3, 2026

Research next steps

  1. Check the stated set-aside against the solicitation and current certifications.
  2. Review the award scope and buyer evidence before making a bid/no-bid decision.