Federal contract award
140D0424C0065
LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | Department of the Interior |
| Office | IBC ACQ SVCS DIRECTORATE (00004) |
| NAICS | 541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) |
| PSC | AJ12 — GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH |
| Parent award / vehicle | Not reported |
| Set-aside | NO SET ASIDE USED. |
| Pricing type | COST PLUS AWARD FEE |
| Obligations | $6.3M |
| Current contract value | $6.3M |
| Potential contract value / ceiling | $6.3M |
| Start date | Aug 1, 2024 |
| Current end date | Sep 30, 2027 |
| Potential end date | Sep 30, 2027 |
| Latest award activity | Sep 4, 2026 |
| Source loaded | Sep 26, 2026 |
Funding and modification history
Showing the latest 7 of 7 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Sep 4, 2026 | P00006 | $1.9M | LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS) |
| Jul 7, 2026 | P00005 | $0 | EO 14398 - BILATERAL MOD TO ADD FAR 52.222-90, AND EXTEND THE PERIOD OF PERFORMANCE OF THE CONTRACT AT NO ADDITIONAL COST TO THE GOVERNMENT. LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA |
| Jan 12, 2026 | P00004 | $579.6K | LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS) |
| Dec 5, 2025 | P00003 | $0 | LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS) |
| Nov 13, 2025 | P00002 | $515.0K | LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS) |
| Jan 16, 2025 | P00001 | $2.3M | LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS) |
| Jul 31, 2024 | 0 | $949.8K | LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS) |
Estimated positioning window
Oct 25, 2026 – Mar 30, 2027
80/100
Why this recompete signal
Contract timing and recorded acquisition signals at the time of calculation.
Stored score: 80/100. Available recorded signals: 75 points.
- Contract end 2027-09-30 (340 days from calculation)
- +35 points
- 91 historical awards in this buyer and category group
- +15 points
- 7 recorded award transactions
- +10 points
- Latest award action: 2026-09-04
- +5 points
- Parent award identifier recorded
- +0 points
- Solicitation identifier recorded
- +10 points
- Linked official forecast
- +0 points
- Calculated on
- 2026-10-25 10:18:04.631876+00:00
The historical group combines buyer, NAICS, and PSC. Multiple awards in this group do not by themselves establish repeated competitions.
Rule-based research score; it does not measure your chance of winning.
This older calculation does not retain a complete reproducible breakdown. Missing or changed inputs are not assigned invented points: Original award-value bonus input.
Recompete score calculated Oct 25, 2026.
Research next steps
- Check the linked forecast or SAM for a confirmed solicitation and current timing.
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.