Federal contract award
80NSSC26P1297
PHOTONIC INTEGRATED CIRCUIT PACKAGING SERVICE FOR 8 PICS. INCLUDES WORE BONDING TO PCB, FIBER ALIGNMENT AND BONDING OF FAUS AND ASSOCIATED PROCESS DEVELOPMENT AND ENGINEERING COSTS.
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | National Aeronautics and Space Administration |
| Office | NASA SHARED SERVICES CENTER |
| NAICS | 813920 — Professional Organizations |
| PSC | R609 — Stenographic Services |
| Parent award / vehicle | Not reported |
| Set-aside | NO SET ASIDE USED. |
| Pricing type | FIRM FIXED PRICE |
| Obligations | $59.5K |
| Current contract value | $59.5K |
| Potential contract value / ceiling | $59.5K |
| Start date | Aug 14, 2026 |
| Current end date | Oct 9, 2026 |
| Potential end date | Oct 9, 2026 |
| Latest award activity | Aug 13, 2026 |
| Source loaded | Sep 26, 2026 |
Funding and modification history
Showing the latest 1 of 1 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Aug 13, 2026 | 0 | $59.5K | PHOTONIC INTEGRATED CIRCUIT PACKAGING SERVICE FOR 8 PICS. INCLUDES WORE BONDING TO PCB, FIBER ALIGNMENT AND BONDING OF FAUS AND ASSOCIATED PROCESS DEVELOPMENT AND ENGINEERING COSTS. |
Research next steps
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.