Federal contract award

FA238524CB003

TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)

Research the contractorView USAspending sourceSave to my pursuit research

Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Defense
OfficeFA2377 USAF AFMC AFRL PZL AFRL RYKS
NAICS541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
PSCAC12 — NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; APPLIED RESEARCH
Parent award / vehicleNot reported
Set-asideNO SET ASIDE USED.
Pricing typeCOST PLUS FIXED FEE
Obligations$12.2M
Current contract value$15.9M
Potential contract value / ceiling$15.9M
Start dateDec 1, 2023
Current end dateDec 18, 2027
Potential end dateFeb 1, 2028
Latest award activityApr 23, 2026
Source loadedSep 19, 2026

Funding and modification history

Showing the latest 11 of 11 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Apr 23, 2026P00009$3.0MTECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
Feb 12, 2026P00008$319.9KTECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
Sep 23, 2025P00007$2.4MTECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
Aug 4, 2025P00006$0TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
Apr 17, 2025P00005$0TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
Aug 14, 2024A00001$0TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
Jun 11, 2024P00004$2.5MTECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
Mar 13, 2024P00003$0TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE
Feb 1, 2024P00002$2.5MTECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE
Jan 26, 2024P00001$0TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE
Dec 1, 20230$1.5MTECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)

Estimated positioning window

Feb 1, 2027 – Aug 1, 2027

Recompete signal:
70/100

Why this recompete signal

Contract timing and recorded acquisition signals at the time of calculation.

Stored score: 70/100. Available recorded signals: 65 points.

Contract end 2028-02-01 (464 days from calculation)
+25 points
79 historical awards in this buyer and category group
+15 points
11 recorded award transactions
+10 points
Latest award action: 2026-04-23
+5 points
Parent award identifier recorded
+0 points
Solicitation identifier recorded
+10 points
Linked official forecast
+0 points
Calculated on
2026-10-25 10:18:04.631876+00:00

The historical group combines buyer, NAICS, and PSC. Multiple awards in this group do not by themselves establish repeated competitions.

Rule-based research score; it does not measure your chance of winning.

This older calculation does not retain a complete reproducible breakdown. Missing or changed inputs are not assigned invented points: Original award-value bonus input.

USAspending award record

. Rule-based research score; positioning dates are estimates.

Recompete score calculated Oct 25, 2026.

Buyer contacts from matching notices

Matched on exact award/solicitation identifier and awarding agency. Source dates describe the notice, not current contact verification.

ContactRolePublished contact methodsEvidenceSource date
BAA CoordinatorContactHR001123S0013@darpa.milSourceJan 9, 2023
BAA CoordinatorContactHR001123S0013@darpa.milSourceDec 6, 2022
BAA CoordinatorContactHR001123S0013@darpa.milSourceNov 18, 2022

Research next steps

  1. Check the linked forecast or SAM for a confirmed solicitation and current timing.
  2. Verify whether remaining options may extend performance beyond the current end date.
  3. Check the stated set-aside against the solicitation and current certifications.
  4. Review the award scope and buyer evidence before making a bid/no-bid decision.