Federal contractors / IDAHO SCIENTIFIC LLC

Federal contract award

FA860419C4003

ANTI-TAMPER EXECUTIVE AGENT, CALL #3, ANTI TAMPER IP FOR INTEL XEON D MULTI CHIP PACKAGE

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Defense
OfficeFA8684 AFLCMC RODK
NAICS541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
PSCAD92 — OTHER DEFENSE - APPLIED RESEARCH/EXPLORATORY DEVELOPMENT
Parent award / vehicleNot reported
Set-asideNO SET ASIDE USED.
Pricing typeCOST PLUS FIXED FEE
Obligations$1.4M
Current contract value$1.4M
Potential contract value / ceiling$1.4M
Start dateMay 7, 2019
Current end dateMay 31, 2022
Potential end dateMay 31, 2022
Latest award activityMar 21, 2022
Source loadedSep 26, 2026

Funding and modification history

Showing the latest 6 of 6 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Mar 21, 2022P00005$155.0KANTI-TAMPER EXECUTIVE AGENT, CALL #3, ANTI TAMPER IP FOR INTEL XEON D MULTI CHIP PACKAGE
Apr 19, 2021P00004$0NO COST EXTENSION FOR ANTI-TAMPER EXECUTIVE AGENT, CALL #3, ANTI TAMPER IP FOR INTELXEON D MULTI CHIP PACKAGE
Apr 14, 2020P00003$626.0KANTI-TAMPER EXECUTIVE AGENT, CALL #3, ANTI TAMPER IP FOR INTEL XEON D MULTI CHIP PACKAGE
Nov 7, 2019P00002$0ANTI-TAMPER EXECUTIVE AGENT, CALL #3, ANTI TAMPER IP FOR INTEL XEON D MULTI CHIP PACKAGE
Oct 22, 2019P00001$0ANTI-TAMPER EXECUTIVE AGENT, CALL #3, ANTI TAMPER IP FOR INTEL XEON D MULTI CHIP PACKAGE
May 7, 20190$629.9KANTI-TAMPER EXECUTIVE AGENT, CALL #3, ANTI TAMPER IP FOR INTEL XEON D MULTI CHIP PACKAGE

Research next steps

  1. Check the stated set-aside against the solicitation and current certifications.
  2. Review the award scope and buyer evidence before making a bid/no-bid decision.