Department of Defense$1.8M obligationsEnds Jun 4, 2027
Federal contract award
FA875025CB031
FABRICATION OF SCALABLE NANOSCALE ELECTRONICS PROVIDE NANOSCALE ELECTRONIC DEVICE FABRICATION AND TESTING SERVICES FOR CMOS AND RESISTIVE MEMORY PLATFORMS, FERROELECTRIC MATERIALS AND DEVICES, CHIP PACKAGING, AND ELECTRONIC TESTING.
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | Department of Defense |
| Office | FA8750 AFRL RIK |
| NAICS | 541713 — Research and Development in Nanotechnology |
| PSC | AC12 — NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; APPLIED RESEARCH |
| Parent award / vehicle | Not reported |
| Set-aside | NO SET ASIDE USED. |
| Pricing type | COST NO FEE |
| Obligations | $800.0K |
| Current contract value | $1.7M |
| Potential contract value / ceiling | $1.7M |
| Start date | Apr 1, 2025 |
| Current end date | Jun 1, 2028 |
| Potential end date | Jun 1, 2028 |
| Latest award activity | Dec 11, 2025 |
| Source loaded | Sep 19, 2026 |
Funding and modification history
Showing the latest 3 of 3 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Dec 11, 2025 | P00002 | $400.0K | FABRICATION OF SCALABLE NANOSCALE ELECTRONICS PROVIDE NANOSCALE ELECTRONIC DEVICE FABRICATION AND TESTING SERVICES FOR CMOS AND RESISTIVE MEMORY PLATFORMS, FERROELECTRIC MATERIALS AND DEVICES, CHIP PACKAGING, AND ELECTRONIC TESTING. |
| Sep 23, 2025 | P00001 | $0 | FABRICATION OF SCALABLE NANOSCALE ELECTRONICS PROVIDE NANOSCALE ELECTRONIC DEVICE FABRICATION AND TESTING SERVICES FOR CMOS AND RESISTIVE MEMORY PLATFORMS, FERROELECTRIC MATERIALS AND DEVICES, CHIP PACKAGING, AND ELECTRONIC TESTING. |
| Apr 1, 2025 | 0 | $400.0K | FABRICATION OF SCALABLE NANOSCALE ELECTRONICS PROVIDE NANOSCALE ELECTRONIC DEVICE FABRICATION AND TESTING SERVICES FOR CMOS AND RESISTIVE MEMORY PLATFORMS, FERROELECTRIC MATERIALS AND DEVICES, CHIP PACKAGING, AND ELECTRONIC TESTING. |
Estimated positioning window
Jun 1, 2027 – Dec 1, 2027
Recompete signal: . Rule-based research score; positioning dates are estimates.
50/100
Why this recompete signal
Contract timing and recorded acquisition signals at the time of calculation.
Stored score: 50/100. Available recorded signals: 45 points.
- Contract end 2028-06-01 (578 days from calculation)
- +25 points
- 1 historical awards in this buyer and category group
- +0 points
- 3 recorded award transactions
- +5 points
- Latest award action: 2025-12-11
- +5 points
- Parent award identifier recorded
- +0 points
- Solicitation identifier recorded
- +10 points
- Linked official forecast
- +0 points
- Calculated on
- 2026-11-01 10:17:53.997580+00:00
The historical group combines buyer, NAICS, and PSC. Multiple awards in this group do not by themselves establish repeated competitions.
Rule-based research score; it does not measure your chance of winning.
This older calculation does not retain a complete reproducible breakdown. Missing or changed inputs are not assigned invented points: Original award-value bonus input.
Recompete score calculated Nov 1, 2026.
Research next steps
- Check the linked forecast or SAM for a confirmed solicitation and current timing.
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.