Federal contract award

HQ072723F0802

PRINTED CIRCUIT BOARDS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS.

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Defense
OfficeDEFENSE MICROELECTRONICS ACTIVITY
NAICS334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
PSC5998 — Electrical and Electronic Assemblies; Boards, Cards, and Associated Hardware
Parent award / vehicleHQ072723A0803
Set-asideSMALL BUSINESS SET ASIDE - TOTAL
Pricing typeFIRM FIXED PRICE
Obligations$9.6K
Current contract value$9.6K
Potential contract value / ceiling$13.5K
Start dateSep 8, 2023
Current end dateOct 13, 2023
Potential end dateMar 5, 2024
Latest award activitySep 8, 2023
Source loadedSep 26, 2026

Funding and modification history

Showing the latest 1 of 1 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Sep 8, 20230$9.6KPRINTED CIRCUIT BOARDS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS.

Research next steps

  1. Verify whether remaining options may extend performance beyond the current end date.
  2. Confirm the ordering vehicle and your eligibility or a qualified teaming route.
  3. Check the stated set-aside against the solicitation and current certifications.
  4. Review the award scope and buyer evidence before making a bid/no-bid decision.