Federal contract award
HQ072724F1608
ENGINEERING SERVICES - THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR THERMAL CONDUCTIVITY.
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | Department of Defense |
| Office | DEFENSE MICROELECTRONICS ACTIVITY |
| NAICS | 541330 — Engineering Services |
| PSC | AC13 — NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; EXPERIMENTAL DEVELOPMENT |
| Parent award / vehicle | HQ072716D0006 |
| Set-aside | Not reported |
| Pricing type | COST PLUS FIXED FEE |
| Obligations | $421.1K |
| Current contract value | $842.2K |
| Potential contract value / ceiling | $842.2K |
| Start date | May 15, 2024 |
| Current end date | Oct 31, 2025 |
| Potential end date | Oct 31, 2025 |
| Latest award activity | Jun 9, 2025 |
| Source loaded | Aug 15, 2026 |
Funding and modification history
Showing the latest 3 of 3 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Jun 9, 2025 | P00004 | $56.2K | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR THERMAL HARDWARE. |
| Apr 16, 2025 | P00003 | $0 | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR CET 24-411. THE PURPOSE OF THIS MODIFICATION IS TO EXTEND THE PERIOD OF PERFORMANCE. |
| Dec 11, 2024 | P00002 | $85.6K | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR GAN SUBSTRATE TRANSFER. MODIFICATION FOR A FUNDING INCREMENT. |
Research next steps
- Confirm the ordering vehicle and your eligibility or a qualified teaming route.
- Review the award scope and buyer evidence before making a bid/no-bid decision.