Federal contract award

HQ072724FE012

PRINTED CIRCUIT BOARDS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS.

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Defense
OfficeDEFENSE MICROELECTRONICS ACTIVITY
NAICS334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
PSC5998 — Electrical and Electronic Assemblies; Boards, Cards, and Associated Hardware
Parent award / vehicleHQ072723A0802
Set-asideNO SET ASIDE USED.
Pricing typeFIRM FIXED PRICE
Obligations$103.5K
Current contract value$103.5K
Potential contract value / ceiling$103.5K
Start dateSep 26, 2024
Current end dateDec 31, 2025
Potential end dateDec 31, 2025
Latest award activityNov 10, 2025
Source loadedSep 26, 2026

Funding and modification history

Showing the latest 4 of 4 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Nov 10, 2025P00003$-15524-4H4 DRMM V2
Sep 23, 2025P00002$024-4H4 DRMM V2
Apr 17, 2025P00001$024-4H4 DRMM V2
Sep 26, 20240$103.6KPRINTED CIRCUIT BOARDS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS.

Research next steps

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