Federal contract award

HQ072724PE004

C1 HORIZONTAL FURNACE TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS AND/OR OPERATE SUCH A FACILITY.

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Defense
OfficeDEFENSE MICROELECTRONICS ACTIVITY
NAICS333242 — Semiconductor Machinery Manufacturing
PSC3670 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery
Parent award / vehicleNot reported
Set-asideNO SET ASIDE USED.
Pricing typeFIRM FIXED PRICE
Obligations$569.2K
Current contract value$569.2K
Potential contract value / ceiling$569.2K
Start dateSep 4, 2024
Current end dateJan 15, 2026
Potential end dateJan 15, 2026
Latest award activityAug 13, 2025
Source loadedAug 15, 2026

Funding and modification history

Showing the latest 1 of 1 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Aug 13, 2025P00001$49.0KPWS 24-4G6 - C1 HIGH TEMP UPGRADE

Buyer contacts from matching notices

Matched on exact award/solicitation identifier and awarding agency. Source dates describe the notice, not current contact verification.

ContactRolePublished contact methodsEvidenceSource date
Nicholas S RobertsContactnicholas.s.roberts8.civ@mail.milSourceJul 23, 2024

Research next steps

  1. Check the stated set-aside against the solicitation and current certifications.
  2. Review the award scope and buyer evidence before making a bid/no-bid decision.