Federal contract award

HQ072725FE024

PRINTED CIRCUIT BOARDS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS.

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Defense
OfficeDEFENSE MICROELECTRONICS ACTIVITY
NAICS334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
PSC5998 — Electrical and Electronic Assemblies; Boards, Cards, and Associated Hardware
Parent award / vehicleHQ072723A0800
Set-asideNO SET ASIDE USED.
Pricing typeFIRM FIXED PRICE
Obligations$22.7K
Current contract value$22.7K
Potential contract value / ceiling$22.7K
Start dateApr 3, 2025
Current end dateApr 18, 2025
Potential end dateApr 18, 2025
Latest award activityApr 3, 2025
Source loadedAug 15, 2026

Funding and modification history

Showing the latest 1 of 1 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Apr 3, 20250$22.7KPRINTED CIRCUIT BOARDS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS.

Research next steps

  1. Confirm the ordering vehicle and your eligibility or a qualified teaming route.
  2. Check the stated set-aside against the solicitation and current certifications.
  3. Review the award scope and buyer evidence before making a bid/no-bid decision.