Federal contract award

HR001117C0090

IGF::OT::IGF LOCKHEED MARTIN CHIPS PHASE 1. THE ASIP TECHNICAL APPROACH IS A THREE-PHASE PROGRAM THAT DEMONSTRATES TWO PRIMARY OBJECTIVES; (1) THE ABILITY OF THE CHIPLET DESIGN APPROACH TO MEET THE CHIPS GOALS OF A MODULAR DESIGN AND FABRICATION FLOW USING OPEN STANDARDS ACHIEVING A LOWER COST, LOWER RISK, SHORTER SCHEDULE , AND LOWER COMPLEXITY SOLUTION TO IC DESIGN, AND (2) THE ABILITY OF THE FUNCTIONAL AND PHYSICAL INTERFACES TO SUPPORT A VARIETY OF SYSTEMS SUBDIVIDED INTO FUNCTIONAL CIRCUIT BLOCKS OR CHIPLETS, SUFFICIENT INTERCONNECT DENSITY IS AVAILABLE, THE INTERCONNECT BANDWIDTHS ARE SCALABLE, THE ENERGY EFFICIENCY SUPPORTS LOW POWER CONNECTIVITY, LATENCIES ARE SUFFICIENTLY LOW, AND OVERALL FLEXIBILITY AND SCALABILITY IS PROVIDED FOR A VARIETY OF APPLICATIONS.