Federal contract award
N0001421C1138
ELECTRONICS DESIGN, TESTING, AND SYSTEMS INTEGRATION WILL:(1) INVESTIGATE CRYOGENIC PACKAGING OF LARGE-SCALE SUPERCONDUCTOR ICS AND MCMS, (2) PERFORM IN-DEPTH MEASUREMENTS, ANALYSIS, AND DESIGN OPTIMIZATION OF SUPERCONDUCTOR CIRCUITS, (3) DEVELOP MET
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | Department of Defense |
| Office | OFFICE OF NAVAL RESEARCH |
| NAICS | 541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) |
| PSC | AC12 — NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; APPLIED RESEARCH |
| Parent award / vehicle | Not reported |
| Set-aside | NO SET ASIDE USED. |
| Pricing type | COST PLUS FIXED FEE |
| Obligations | $1.4M |
| Current contract value | $4.8M |
| Potential contract value / ceiling | $6.8M |
| Start date | Sep 27, 2021 |
| Current end date | Sep 26, 2026 |
| Potential end date | Sep 26, 2026 |
| Latest award activity | Jun 3, 2026 |
| Source loaded | Sep 26, 2026 |
Funding and modification history
Showing the latest 8 of 8 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Jun 3, 2026 | P00006 | $0 | MODIFICATION TO ADD GFP. |
| Apr 25, 2023 | P00005 | $0 | ELECTRONICS DESIGN, TESTING, AND SYSTEMS INTEGRATION WILL:(1) INVESTIGATE CRYOGENIC PACKAGING OF LARGE-SCALE SUPERCONDUCTOR ICS AND MCMS, (2) PERFORM IN-DEPTH MEASUREMENTS, ANALYSIS, AND DESIGN OPTIMIZATION OF SUPERCONDUCTOR CIRCUITS, (3) DEVELOP MET |
| Mar 21, 2023 | P00004 | $0 | ELECTRONICS DESIGN, TESTING, AND SYSTEMS INTEGRATION WILL:(1) INVESTIGATE CRYOGENIC PACKAGING OF LARGE-SCALE SUPERCONDUCTOR ICS AND MCMS, (2) PERFORM IN-DEPTH MEASUREMENTS, ANALYSIS, AND DESIGN OPTIMIZATION OF SUPERCONDUCTOR CIRCUITS, (3) DEVELOP MET |
| Jan 11, 2023 | ARZ999 | $0 | ELECTRONICS DESIGN, TESTING, AND SYSTEMS INTEGRATION WILL:(1) INVESTIGATE CRYOGENIC PACKAGING OF LARGE-SCALE SUPERCONDUCTOR ICS AND MCMS, (2) PERFORM IN-DEPTH MEASUREMENTS, ANALYSIS, AND DESIGN OPTIMIZATION OF SUPERCONDUCTOR CIRCUITS, (3) DEVELOP MET |
| Feb 2, 2022 | P00003 | $487.4K | ELECTRONICS DESIGN, TESTING, AND SYSTEMS INTEGRATION WILL:(1) INVESTIGATE CRYOGENIC PACKAGING OF LARGE-SCALE SUPERCONDUCTOR ICS AND MCMS, (2) PERFORM IN-DEPTH MEASUREMENTS, ANALYSIS, AND DESIGN OPTIMIZATION OF SUPERCONDUCTOR CIRCUITS, (3) DEVELOP MET |
| Dec 6, 2021 | P00002 | $305.0K | ELECTRONICS DESIGN, TESTING, AND SYSTEMS INTEGRATION WILL:(1) INVESTIGATE CRYOGENIC PACKAGING OF LARGE-SCALE SUPERCONDUCTOR ICS AND MCMS, (2) PERFORM IN-DEPTH MEASUREMENTS, ANALYSIS, AND DESIGN OPTIMIZATION OF SUPERCONDUCTOR CIRCUITS, (3) DEVELOP MET |
| Oct 6, 2021 | P00001 | $0 | ELECTRONICS DESIGN, TESTING, AND SYSTEMS INTEGRATION WILL:(1) INVESTIGATE CRYOGENIC PACKAGING OF LARGE-SCALE SUPERCONDUCTOR ICS AND MCMS, (2) PERFORM IN-DEPTH MEASUREMENTS, ANALYSIS, AND DESIGN OPTIMIZATION OF SUPERCONDUCTOR CIRCUITS, (3) DEVELOP MET |
| Sep 27, 2021 | 0 | $615.4K | ELECTRONICS DESIGN, TESTING, AND SYSTEMS INTEGRATION WILL:(1) INVESTIGATE CRYOGENIC PACKAGING OF LARGE-SCALE SUPERCONDUCTOR ICS AND MCMS, (2) PERFORM IN-DEPTH MEASUREMENTS, ANALYSIS, AND DESIGN OPTIMIZATION OF SUPERCONDUCTOR CIRCUITS, (3) DEVELOP MET |
Research next steps
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.