Federal contract award
N0016725P1125
DIODE ASSEMBLY FOR SLA 3D PRINTER
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | Department of Defense |
| Office | NSWC CARDEROCK |
| NAICS | 334413 — Semiconductor and Related Device Manufacturing |
| PSC | 5961 — Semiconductor Devices and Associated Hardware |
| Parent award / vehicle | Not reported |
| Set-aside | SMALL BUSINESS SET ASIDE - TOTAL |
| Pricing type | FIRM FIXED PRICE |
| Obligations | $10.3K |
| Current contract value | $10.3K |
| Potential contract value / ceiling | $10.3K |
| Start date | Aug 27, 2025 |
| Current end date | Sep 30, 2025 |
| Potential end date | Sep 30, 2025 |
| Latest award activity | Aug 27, 2025 |
| Source loaded | Aug 15, 2026 |
Funding and modification history
Showing the latest 1 of 1 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Aug 27, 2025 | 0 | $10.3K | DIODE ASSEMBLY FOR SLA 3D PRINTER |
Research next steps
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.