Federal contract award
N0017325P0001
GLOBAL WAFERS (GW) 300MM FDSOI WAFER SOI THICKNESS TARGET = 120A AND BOX THICKNESS TARGET = 200A.
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | Department of Defense |
| Office | NAVAL RESEARCH LABORATORY |
| NAICS | 334413 — Semiconductor and Related Device Manufacturing |
| PSC | 5961 — Semiconductor Devices and Associated Hardware |
| Parent award / vehicle | Not reported |
| Set-aside | NO SET ASIDE USED. |
| Pricing type | FIRM FIXED PRICE |
| Obligations | $1.7K |
| Current contract value | $1.7K |
| Potential contract value / ceiling | $1.7K |
| Start date | Oct 1, 2024 |
| Current end date | Nov 1, 2024 |
| Potential end date | Nov 1, 2024 |
| Latest award activity | Oct 1, 2024 |
| Source loaded | Aug 15, 2026 |
Funding and modification history
Showing the latest 1 of 1 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Oct 1, 2024 | 0 | $1.7K | GLOBAL WAFERS (GW) 300MM FDSOI WAFER SOI THICKNESS TARGET = 120A AND BOX THICKNESS TARGET = 200A. |
Research next steps
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.