Federal contract award

W911NF24C0041

ATOMIC FUSION WAFER BONDING TOOL FOR ULTRA-HIGH-POWER SWITCHES

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Defense
OfficeW6QK ACC-APG DURHAM
NAICS541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
PSCAJ11 — GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; BASIC RESEARCH
Parent award / vehicleNot reported
Set-asideSMALL BUSINESS SET ASIDE - TOTAL
Pricing typeFIRM FIXED PRICE
Obligations$1.7M
Current contract value$1.7M
Potential contract value / ceiling$1.7M
Start dateMar 1, 2024
Current end dateMay 31, 2026
Potential end dateMay 31, 2026
Latest award activityJan 20, 2026
Source loadedSep 19, 2026

Funding and modification history

Showing the latest 4 of 4 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Jan 20, 2026P00004$0ATOMIC FUSION WAFER BONDING TOOL FOR ULTRA-HIGH POWER SWITCHES.
Apr 17, 2025P00003$0ATOMIC FUSION WAFER BONDING TOOL FOR ULTRA-HIGH POWER SWITCHES.
Mar 27, 2025P00002$815.5KATOMIC FUSION WAFER BONDING TOOL FOR ULTRA-HIGH POWER SWITCHES
Oct 22, 2024P00001$0ATOMIC FUSION WAFER BONDING TOOL FOR ULTRA-HIGH-POWER SWITCHES

Research next steps

  1. Check the stated set-aside against the solicitation and current certifications.
  2. Review the award scope and buyer evidence before making a bid/no-bid decision.