IDV vehicle
HQ072726AE002
PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | Department of Defense |
| Office | DEFENSE MICROELECTRONICS ACTIVITY |
| NAICS | 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing |
| PSC | 5998 — Electrical and Electronic Assemblies; Boards, Cards, and Associated Hardware |
| Parent award / vehicle | Not reported |
| Set-aside | Not reported |
| Pricing type | ORDER DEPENDENT (IDV ALLOWS PRICING ARRANGEMENT TO BE DETERMINED SEPARATELY FOR EACH ORDER) |
| Obligations | $0 |
| Current contract value | Not reported |
| Potential contract value / ceiling | $1.3M |
| Start date | Feb 26, 2026 |
| Current end date | Not available |
| Potential end date | Not available |
| Latest award activity | May 12, 2026 |
| Source loaded | Sep 26, 2026 |
Funding and modification history
Showing the latest 2 of 2 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| May 12, 2026 | P00001 | $0 | PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS. |
| Feb 23, 2026 | 0 | $0 | PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS. |
Buyer contacts from matching notices
Matched on exact award/solicitation identifier and awarding agency. Source dates describe the notice, not current contact verification.
| Contact | Role | Published contact methods | Evidence | Source date |
|---|---|---|---|---|
| RYAN C TUNG | Contact | RYAN.C.TUNG.CIV@MAIL.MIL | Source | Dec 1, 2025 |
| RYAN C TUNG | Contact | RYAN.C.TUNG.CIV@MAIL.MIL | Source | Dec 1, 2025 |
| RYAN C TUNG | Contact | RYAN.C.TUNG.CIV@MAIL.MIL | Source | Aug 15, 2025 |
| RYAN C TUNG | Contact | RYAN.C.TUNG.CIV@MAIL.MIL | Source | Jul 29, 2025 |
| RYAN C TUNG | Contact | RYAN.C.TUNG.CIV@MAIL.MIL | Source | Jul 25, 2025 |
| RYAN C TUNG | Contact | RYAN.C.TUNG.CIV@MAIL.MIL | Source | Jul 24, 2025 |
Research next steps
- Review the award scope and buyer evidence before making a bid/no-bid decision.