Overview
- Legal name
- PYRAMID SEMICONDUCTOR CORP.
- Registered location
- SUNNYVALE, CA, USA
- Website
- Company website ↗
- Primary NAICS
- 334413 — Semiconductor and Related Device Manufacturing
- Latest award activity
- Dec 30, 2024
Read company summary
PYRAMID SEMICONDUCTOR CORP. is associated with UEI HC3DHL9DN8E6 and CAGE 3DTT2 in public federal records. AcornBids currently links 1 prime award totaling $11.7K in obligations to this entity. Its largest recorded federal customer by obligations is Department of Defense. Its recorded federal awards include work classified as Semiconductor and Related Device Manufacturing. These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 334413 (Semiconductor and Related Device Manufacturing). Its public SAM.gov registration lists SUNNYVALE, CA, USA.
At a glance
Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Oct 24, 2026. Refresh pending; these totals may be out of date.
Business information
Public SAM.gov registration details.
- Legal name
- PYRAMID SEMICONDUCTOR CORP.
- UEI
- HC3DHL9DN8E6
- CAGE
- 3DTT2
- Registered address
- 1249 REAMWOOD AVE, SUNNYVALE, CA, 94089, USA
- Registration status
- Active
- Primary NAICS
- 334413 — Semiconductor and Related Device Manufacturing
- SAM activation
- Apr 13, 2026
- Initial registration
- Feb 24, 2003
- Entity start
- Mar 5, 2021
- SAM updated
- Apr 13, 2026
- Registration expires
- Apr 9, 2027
- Fiscal year end
- Oct 31
- Place of incorporation
- FL, USA
Research brief
Source facts
- Loaded prime-award records link 1 awards and $11,650 in reported obligations to this legal entity. Source
- Recorded awards include Semiconductor and Related Device Manufacturing (NAICS 334413); this classification is not proof of every company capability. Source
- An example award describes: 8510570488!MICROCIRCUIT,MEMORY Source
Federal award analysis
Net transaction obligations by federal fiscal period.
Reported transaction obligations by federal fiscal period; includes deobligations. Missing transactions are not estimated. Histories follow awards currently assigned to this recipient and may include transactions under an earlier recipient. Coverage: 1 of 1 selected awards. Select a period to explore its awards.
Funding change
Dated, valued transaction obligations in equal-length adjacent periods; missing records are unknown. Default: last completed federal fiscal year. Percentage is unavailable when the prior period has no positive reported obligations.
| Measure | Reported value |
|---|---|
| Current period | Oct 1, 2025 – Sep 30, 2026 |
| Current obligations | Not reported |
| Prior period | Oct 1, 2024 – Sep 30, 2025 |
| Prior obligations | $0 |
| Change | Not reported |
| Growth | Not comparable |
Where the work is performed
State tile map; darker tiles have larger absolute net obligations. Outlined tiles indicate net deobligations. Unshaded tiles have no reported transactions in this selection. Other locations appear in the table.
Agencies
| Category | Period obligations | Awards |
|---|---|---|
| Department of Defense | $0 | 1 |
Offices
| Category | Period obligations | Awards |
|---|---|---|
| DLA LAND AND MARITIME | $0 | 1 |
Naics
| Category | Period obligations | Awards |
|---|---|---|
| 334413 — Semiconductor and Related Device Manufacturing | $0 | 1 |
Psc
| Category | Period obligations | Awards |
|---|---|---|
| 5962 — Microcircuits, Electronic | $0 | 1 |
Vehicles
| Category | Period obligations | Awards |
|---|---|---|
| Unclassified | $0 | 1 |
States
| Category | Period obligations | Awards |
|---|---|---|
| CA | $0 | 1 |
Set Asides
| Category | Period obligations | Awards |
|---|---|---|
| NO SET ASIDE USED. | $0 | 1 |
Recent federal awards
Prime contract awards. Select an award to review its history and source evidence.
| Award / description | Awarding agency | Obligations | Start date | End date |
|---|---|---|---|---|
| SPE7M524P41618510570488!MICROCIRCUIT,MEMORY | Department of Defense | $11.7K | Apr 16, 2024 | Jan 27, 2025 |
Registration, certifications & contacts
| Registration evidence | Date |
|---|---|
| SAM updated | Apr 13, 2026 |
| Source loaded | Sep 2, 2026 |
| Initial registration | Feb 24, 2003 |
| Entity start | Mar 5, 2021 |
| Industry | Reported size status |
|---|---|
| 334413 — Semiconductor and Related Device Manufacturing | Not reported |
| Contact | Role | Published contact methods | Evidence | Source date |
|---|---|---|---|---|
| ERIN ROLFE | Government business | Contact method not published | SAM registration | Not available |
| ERIN ROLFE | Electronic business | Contact method not published | SAM registration | Not available |
Registered industries
- 334413 — Semiconductor and Related Device Manufacturing
Registered products and services
- 5962 — Microcircuits, Electronic
Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source
Reported subsidiary tree
Ownership follows reported parent UEIs.
- HEICO CORPUEI WF9TN8AWH8K5
- AEROANTENNA TECHNOLOGY, INCUEI N8HTATHCQ4K5
- AIR COST CONTROL US, LLCUEI SRCCJ2YG6BN6
- ANALOG MODULES, INCUEI X25BP4RLNCK8
- ASC INTERNATIONAL, INC.UEI PTWBK7HUD6E9
- BLUE AEROSPACE LLCUEI MV2FTFU6ELL8
- CARBON BY DESIGN, LLCUEI LEENH1ZGWYR4
- CONNECTRONICS CORPUEI CA3SCBN6PYP5
- CSI AEROSPACE, INC.UEI VLJFHLKD6XA5
- DB CONTROLUEI NCG7W2K7P7R6
- DIELECTRIC SCIENCES, INC.UEI TMDLFMMAEFZ8
- ENGINEERING DESIGN TEAM, INC.UEI SSQCANDH21M9
- FUTURE AVIATION INCUEI T9YDSKR72SH8
- HEICO AEROSPACE CORPUEI C7RAXD2CDDF1
- INERTIAL AIRLINE SERVICES INCUEI RPT3U7KGE4L9
- IRCAMERA LLCUEI GMRJVKNWMFC3
- JET AVION CORPUEI H8PJQK5TU3N5
- JETSEAL INCUEI NJP8ZFMGUGL1
- LUCIX CORPUEI N7CUY7C5YNB3
- MIDWEST MICROWAVE SOLUTIONS, INC.UEI QZ7JCJTMKTY5
- PYRAMID SEMICONDUCTOR CORP.UEI HC3DHL9DN8E6
- RADIANT POWER CORPUEI QP57CJTNKB53
- RADIANT POWER IDC, LLCUEI WUN9D37NGDP1
- RESEARCH ELECTRONICS INTERNATIONAL, L.L.C.UEI N4LLJP3VYN48
- RH LABORATORIES, INC.UEI CYJTQSJ2N1L9
- ROBERTSON FUEL SYSTEMS, L.L.C.UEI G4M3KUF95AL3
- ROCKY MOUNTAIN HYDROSTATICS, LLCUEI TJKJJ8NE44C9
- SANTA BARBARA INFRARED, INC.UEI TLC5M9HQ62P3
- SEAL DYNAMICS LLCUEI Y1M9BKYLXL58
- SENSOR TECHNOLOGY ENGINEERING LLCUEI TGCRLMJWHDG4
- THE BECHDON COMPANY, LLCUEI EXMKFGKSLQ63
- THERMAL STRUCTURES, INCUEI ENP2ZMAVWJB3
- TRAD TESTS AND RADIATIONS, INCUEI PRR5L1R3H7H9
- TRANSFORMATIONAL SECURITY, LLCUEI J5UNNCETDZ24
- TTT-CUBED INCUEI C6YFXFEM81Q5
- TURBINE KINETICS, INCUEI GAECL1MRJGS5
- TURBINE KINETICS, INC.UEI HWZVTYNJ6J83
- VPT, INC.UEI MC5HQM6XUHR7
Corporate family
Reported ownership links. Award and funding explorers can include this family.
| Legal entity | Reported parent UEI | Source loaded |
|---|---|---|
| HEICO CORP | — | Sep 2, 2026 |
| AEROANTENNA TECHNOLOGY, INC | WF9TN8AWH8K5 | Sep 26, 2026 |
| AIR COST CONTROL US, LLC | WF9TN8AWH8K5 | Sep 26, 2026 |
| ANALOG MODULES, INC | WF9TN8AWH8K5 | Sep 2, 2026 |
| ASC INTERNATIONAL, INC. | WF9TN8AWH8K5 | Sep 26, 2026 |
| BLUE AEROSPACE LLC | WF9TN8AWH8K5 | Sep 26, 2026 |
| CARBON BY DESIGN, LLC | WF9TN8AWH8K5 | Sep 26, 2026 |
| CONNECTRONICS CORP | WF9TN8AWH8K5 | Sep 19, 2026 |
| CSI AEROSPACE, INC. | WF9TN8AWH8K5 | Sep 26, 2026 |
| DB CONTROL | WF9TN8AWH8K5 | Sep 26, 2026 |
| DIELECTRIC SCIENCES, INC. | WF9TN8AWH8K5 | Sep 2, 2026 |
| ENGINEERING DESIGN TEAM, INC. | WF9TN8AWH8K5 | Sep 26, 2026 |
| FUTURE AVIATION INC | WF9TN8AWH8K5 | Sep 2, 2026 |
| HEICO AEROSPACE CORP | WF9TN8AWH8K5 | Sep 19, 2026 |
| INERTIAL AIRLINE SERVICES INC | WF9TN8AWH8K5 | Sep 26, 2026 |
| IRCAMERA LLC | WF9TN8AWH8K5 | Sep 26, 2026 |
| JET AVION CORP | WF9TN8AWH8K5 | Sep 26, 2026 |
| JETSEAL INC | WF9TN8AWH8K5 | Sep 26, 2026 |
| LUCIX CORP | WF9TN8AWH8K5 | Sep 19, 2026 |
| MIDWEST MICROWAVE SOLUTIONS, INC. | WF9TN8AWH8K5 | Sep 26, 2026 |
| PYRAMID SEMICONDUCTOR CORP. | WF9TN8AWH8K5 | Sep 2, 2026 |
| RADIANT POWER CORP | WF9TN8AWH8K5 | Sep 26, 2026 |
| RADIANT POWER IDC, LLC | WF9TN8AWH8K5 | Sep 2, 2026 |
| RESEARCH ELECTRONICS INTERNATIONAL, L.L.C. | WF9TN8AWH8K5 | Sep 26, 2026 |
| RH LABORATORIES, INC. | WF9TN8AWH8K5 | Sep 26, 2026 |
| ROBERTSON FUEL SYSTEMS, L.L.C. | WF9TN8AWH8K5 | Sep 26, 2026 |
| ROCKY MOUNTAIN HYDROSTATICS, LLC | WF9TN8AWH8K5 | Sep 26, 2026 |
| SANTA BARBARA INFRARED, INC. | WF9TN8AWH8K5 | Sep 26, 2026 |
| SEAL DYNAMICS LLC | WF9TN8AWH8K5 | Sep 26, 2026 |
| SENSOR TECHNOLOGY ENGINEERING LLC | WF9TN8AWH8K5 | Sep 26, 2026 |
| THE BECHDON COMPANY, LLC | WF9TN8AWH8K5 | Sep 2, 2026 |
| THERMAL STRUCTURES, INC | WF9TN8AWH8K5 | Sep 26, 2026 |
| TRAD TESTS AND RADIATIONS, INC | WF9TN8AWH8K5 | Sep 26, 2026 |
| TRANSFORMATIONAL SECURITY, LLC | WF9TN8AWH8K5 | Sep 26, 2026 |
| TTT-CUBED INC | WF9TN8AWH8K5 | Sep 26, 2026 |
| TURBINE KINETICS, INC | WF9TN8AWH8K5 | Sep 26, 2026 |
| TURBINE KINETICS, INC. | WF9TN8AWH8K5 | Sep 26, 2026 |
| VPT, INC. | WF9TN8AWH8K5 | Sep 26, 2026 |
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Data coverage and methodology
Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.
Disclosed relationships only. Missing records do not establish that a contractor has no partners. Ambiguous parent award identifiers are excluded.
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