Overview
- Legal name
- DEC ELECTRONIC ASSEMBLY LLC
- Also known as
- DEC LLC
- Registered location
- SANTA ANA, CA, USA
- Website
- Company website ↗
- Primary NAICS
- 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Latest award activity
- Jun 9, 2026
Read company summary
DEC ELECTRONIC ASSEMBLY LLC is associated with UEI HNBMTBE4EZP4 and CAGE 5LGW7 in public federal records. AcornBids currently links 2 prime awards totaling $404.0K in obligations to this entity. Its largest recorded federal customer by obligations is Department of Defense. Its recorded federal awards include work classified as Printed Circuit Assembly (Electronic Assembly) Manufacturing. These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 334418 (Printed Circuit Assembly (Electronic Assembly) Manufacturing). Its public SAM.gov registration lists SANTA ANA, CA, USA.
At a glance
Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Oct 23, 2026. Refresh pending; these totals may be out of date.
Business information
Public SAM.gov registration details.
- Legal name
- DEC ELECTRONIC ASSEMBLY LLC
- Doing business as
- DEC LLC
- UEI
- HNBMTBE4EZP4
- CAGE
- 5LGW7
- Registered address
- 1790 E MCFADDEN AVE STE 105, SANTA ANA, CA, 92705, USA
- Registration status
- Active
- Primary NAICS
- 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
- SAM activation
- May 12, 2026
- Initial registration
- Jul 22, 2009
- Entity start
- Aug 1, 2008
- SAM updated
- May 12, 2026
- Registration expires
- May 8, 2027
- Fiscal year end
- Dec 31
- Place of incorporation
- CA, USA
Research brief
Source facts
- Loaded prime-award records link 2 awards and $404,032 in reported obligations to this legal entity. Source
- Recorded awards include Printed Circuit Assembly (Electronic Assembly) Manufacturing (NAICS 334418); this classification is not proof of every company capability. Source
- An example award describes: THIS IS A PROCUREMENT FOR TWO HUNDRED NINETY (290) CUSTOM, COMMERCIAL IPC-A-610, J-STD-001, CLASS 3 ASSEMBLY SOLDER PROCESS: ROHS WHICH ARE CRITICAL COMPONENTS USED TO CONFIGURE BOLT REVISION 5 HANDHELD DEVICES. Source
Federal award analysis
Net transaction obligations by federal fiscal period.
Reported transaction obligations by federal fiscal period; includes deobligations. Missing transactions are not estimated. Histories follow awards currently assigned to this recipient and may include transactions under an earlier recipient. Coverage: 2 of 2 selected awards. Select a period to explore its awards.
Funding change
Dated, valued transaction obligations in equal-length adjacent periods; missing records are unknown. Default: last completed federal fiscal year. Percentage is unavailable when the prior period has no positive reported obligations.
| Measure | Reported value |
|---|---|
| Current period | Oct 1, 2025 – Sep 30, 2026 |
| Current obligations | $404.0K |
| Prior period | Oct 1, 2024 – Sep 30, 2025 |
| Prior obligations | Not reported |
| Change | Not reported |
| Growth | Not comparable |
Where the work is performed
State tile map; darker tiles have larger absolute net obligations. Outlined tiles indicate net deobligations. Unshaded tiles have no reported transactions in this selection. Other locations appear in the table.
Agencies
| Category | Period obligations | Awards |
|---|---|---|
| Department of Defense | $404.0K | 2 |
Offices
| Category | Period obligations | Awards |
|---|---|---|
| NIWC PACIFIC | $404.0K | 2 |
Naics
| Category | Period obligations | Awards |
|---|---|---|
| 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing | $404.0K | 2 |
Psc
| Category | Period obligations | Awards |
|---|---|---|
| 5340 — Hardware | $301.1K | 1 |
| 5998 — Electrical and Electronic Assemblies; Boards, Cards, and Associated Hardware | $103.0K | 1 |
Vehicles
| Category | Period obligations | Awards |
|---|---|---|
| Unclassified | $404.0K | 2 |
States
| Category | Period obligations | Awards |
|---|---|---|
| CA | $404.0K | 2 |
Set Asides
| Category | Period obligations | Awards |
|---|---|---|
| NO SET ASIDE USED. | $404.0K | 2 |
Recent federal awards
Prime contract awards. Select an award to review its history and source evidence.
| Award / description | Awarding agency | Obligations | Start date | End date |
|---|---|---|---|---|
| N6600126P6145THIS IS A PROCUREMENT FOR TWO HUNDRED NINETY (290) CUSTOM, COMMERCIAL IPC-A-610, J-STD-001, CLASS 3 ASSEMBLY SOLDER PROCESS: ROHS WHICH ARE CRITICAL COMPONENTS USED TO CONFIGURE… | Department of Defense | $103.0K | Jun 9, 2026 | Jun 15, 2026 |
| N6600126P6040THIS IS A PROCUREMENT FOR TWO HUNDRED (200) CUSTOM, COMMERCIAL BOLT REVISION 4.1B CIRCUIT CARD ASSEMBLIES (CCAS). THE PROCUREMENT IS STRUCTURED INTO THREE DISTINCT BUT INTEGRATED… | Department of Defense | $301.1K | Feb 12, 2026 | May 28, 2026 |
Registration, certifications & contacts
| Registration evidence | Date |
|---|---|
| SAM updated | May 12, 2026 |
| Source loaded | Sep 26, 2026 |
| Initial registration | Jul 22, 2009 |
| Entity start | Aug 1, 2008 |
Registration classifications: Small Business. These are separate from the reported certificates above.
| Industry | Reported size status |
|---|---|
| 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing | Not reported |
| Contact | Role | Published contact methods | Evidence | Source date |
|---|---|---|---|---|
| MARK CLARK | Government business | Contact method not published | SAM registration | Not available |
| YEN QUACH | Alternate government business | Contact method not published | SAM registration | Not available |
| YEN QUACH | Electronic business | Contact method not published | SAM registration | Not available |
| YEN QUACH | Alternate electronic business | Contact method not published | SAM registration | Not available |
Registered industries
- 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source
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Data coverage and methodology
Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.
Disclosed relationships only. Missing records do not establish that a contractor has no partners. Ambiguous parent award identifiers are excluded.
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