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AXUS TECHNOLOGY LLC

UEI U93EWTYKYBK5CAGE 43ZL7Company website ↗

E
Small Business

Overview

Legal name
AXUS TECHNOLOGY LLC
Registered location
CHANDLER, AZ, USA
Website
Company website ↗
Primary NAICS
333242 — Semiconductor Machinery Manufacturing
Latest award activity
Mar 25, 2025
Read company summary

AXUS TECHNOLOGY LLC is associated with UEI U93EWTYKYBK5 and CAGE 43ZL7 in public federal records. AcornBids currently links 1 prime award totaling $569.1K in obligations to this entity. Its largest recorded federal customer by obligations is Department of Defense. Its recorded federal awards include work classified as Semiconductor Machinery Manufacturing. These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 333242 (Semiconductor Machinery Manufacturing). Its public SAM.gov registration lists CHANDLER, AZ, USA.

At a glance

Lifetime prime obligations$569.1K
Prime awards1
Awards with future end dates0
Top-agency concentration100.0%

Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Oct 24, 2026. Refresh pending; these totals may be out of date.

Business information

Public SAM.gov registration details.

Legal name
AXUS TECHNOLOGY LLC
UEI
U93EWTYKYBK5
CAGE
43ZL7
Registered address
7474 W CHANDLER BLVD, CHANDLER, AZ, 85226, USA
Registration status
E
Primary NAICS
333242 — Semiconductor Machinery Manufacturing
SAM activation
May 16, 2025
Initial registration
Aug 31, 2005
Entity start
Jan 1, 2002
SAM updated
May 15, 2026
Registration expires
May 15, 2026
Fiscal year end
Dec 31
Place of incorporation
AZ, USA

View SAM.gov source

Research brief

Source facts

  • Loaded prime-award records link 1 awards and $569,080 in reported obligations to this legal entity. Source
  • Recorded awards include Semiconductor Machinery Manufacturing (NAICS 333242); this classification is not proof of every company capability. Source
  • An example award describes: WAFER GRINDER AND CHEMICAL MECHANICAL POLISHER (CMP) TOOL Source

Federal award analysis

Net transaction obligations by federal fiscal period.

Selected transaction obligations$569.1K
Prime contracts
$569.1KFY2025

Reported transaction obligations by federal fiscal period; includes deobligations. Missing transactions are not estimated. Histories follow awards currently assigned to this recipient and may include transactions under an earlier recipient. Coverage: 1 of 1 selected awards. Select a period to explore its awards.

Explore funding & geography →View quarterly funding

Funding change

Dated, valued transaction obligations in equal-length adjacent periods; missing records are unknown. Default: last completed federal fiscal year. Percentage is unavailable when the prior period has no positive reported obligations.

MeasureReported value
Current periodOct 1, 2025 – Sep 30, 2026
Current obligationsNot reported
Prior periodOct 1, 2024 – Sep 30, 2025
Prior obligations$569.1K
ChangeNot reported
GrowthNot comparable

Where the work is performed

AKMEVTNHWAIDMTNDMNWIMINYMAORNVWYSDIAILINOHPANJCTRICAUTCONEMOKYWVVAMDDEAZNMKSARTNNCSCDCOKLAMSALGAHITXFL

State tile map; darker tiles have larger absolute net obligations. Outlined tiles indicate net deobligations. Unshaded tiles have no reported transactions in this selection. Other locations appear in the table.

Agencies
CategoryPeriod obligationsAwards
Department of Defense$569.1K1
Offices
CategoryPeriod obligationsAwards
NAVAL RESEARCH LABORATORY$569.1K1
Naics
CategoryPeriod obligationsAwards
333242 — Semiconductor Machinery Manufacturing$569.1K1
Psc
CategoryPeriod obligationsAwards
3670 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery$569.1K1
Vehicles
CategoryPeriod obligationsAwards
Unclassified$569.1K1
States
CategoryPeriod obligationsAwards
AZ$569.1K1
Set Asides
CategoryPeriod obligationsAwards
SMALL BUSINESS SET ASIDE - TOTAL$569.1K1

Recent federal awards

Prime contract awards. Select an award to review its history and source evidence.

Award / descriptionAwarding agencyObligationsStart dateEnd date
N0017325P2417WAFER GRINDER AND CHEMICAL MECHANICAL POLISHER (CMP) TOOLDepartment of Defense$569.1KMar 25, 2025Sep 6, 2025
Explore, filter and export all awards →SubcontractsGrants & subgrants

Registration, certifications & contacts

Registration evidenceDate
SAM updatedMay 15, 2026
Source loadedSep 26, 2026
Initial registrationAug 31, 2005
Entity startJan 1, 2002

Registration classifications: Small Business. These are separate from the reported certificates above.

IndustryReported size status
333242 — Semiconductor Machinery ManufacturingNot reported
ContactRolePublished contact methodsEvidenceSource date
DAN TROJANGovernment businessContact method not publishedSAM registrationNot available
DAN TROJANElectronic businessContact method not publishedSAM registrationNot available
BEN MCKEEAlternate electronic businessContact method not publishedSAM registrationNot available
Registered industries
  • 333242 — Semiconductor Machinery Manufacturing
Registered products and services
  • 3670 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery

Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source

Related companies worth researching

Explore the customer, work and award-size evidence behind each match.

UNITED MINERAL & CHEMICAL CORP

1 shared agency customer(s); Shared work: 333242 — Semiconductor Machinery Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
2 awards

PLASMABILITY LLC

1 shared agency customer(s); Shared work: 333242 — Semiconductor Machinery Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
2 awards

DISCO HI-TEC AMERICA, INC

1 shared agency customer(s); Shared work: 333242 — Semiconductor Machinery Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
1 awards

SCR, INC.

1 shared agency customer(s); Shared work: 333242 — Semiconductor Machinery Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
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RAITH AMERICA INC

1 shared agency customer(s); Shared work: 333242 — Semiconductor Machinery Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
1 awards

OXFORD INSTRUMENTS AMERICA, INC.

1 shared agency customer(s); Shared work: 333242 — Semiconductor Machinery Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
1 awards
Data coverage and methodology

Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.

Disclosed relationships only. Missing records do not establish that a contractor has no partners. Ambiguous parent award identifiers are excluded.

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