Active
Small Business
Overview
- Legal name
- SIENNA TECHNOLOGIES, INC.
- Also known as
- SIENNA TECHNOLOGIES INC
- Registered location
- MUKILTEO, WA, USA
- Website
- Company website ↗
- Primary NAICS
- 334419 — Other Electronic Component Manufacturing
- Latest award activity
- Jul 31, 2026
Read company summary
SIENNA TECHNOLOGIES, INC. is associated with UEI W8VZALJ8J617 and CAGE 084Z5 in public federal records. AcornBids currently links 7 prime awards totaling $725.3K in obligations to this entity. Its largest recorded federal customer by obligations is National Aeronautics and Space Administration. Its recorded federal awards include work classified as Other Electronic Component Manufacturing; Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology); All Other Miscellaneous Electrical Equipment and Component Manufacturing. These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 334419 (Other Electronic Component Manufacturing). Its public SAM.gov registration lists MUKILTEO, WA, USA.
At a glance
Lifetime prime obligations$725.3K
Prime awards7
Awards with future end dates2
Top-agency concentration92.7%
Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Sep 28, 2026. Refresh pending; these totals may be out of date.
Business information
Public SAM.gov registration details.
- Legal name
- SIENNA TECHNOLOGIES, INC.
- Doing business as
- SIENNA TECHNOLOGIES INC
- UEI
- W8VZALJ8J617
- CAGE
- 084Z5
- Registered address
- 11611 49TH PL W, MUKILTEO, WA, 98275, USA
- Registration status
- Active
- Primary NAICS
- 334419 — Other Electronic Component Manufacturing
- SAM activation
- Dec 30, 2025
- Initial registration
- Mar 22, 2002
- Entity start
- May 23, 1996
- SAM updated
- Dec 30, 2025
- Registration expires
- Dec 26, 2026
- Fiscal year end
- Dec 31
- Place of incorporation
- WA, USA
Federal award analysis
Net transaction obligations by federal fiscal period.
Transaction history is not available in the loaded data. Annual funding is not estimated from current award totals.
Recent federal awards
Prime contract awards. Select an award to review its history and source evidence.
| Award / description | Awarding agency | Obligations | Start date | End date |
|---|---|---|---|---|
| 80NSSC24PC199MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS | National Aeronautics and Space Administration | $65.5K | Aug 26, 2024 | Dec 31, 2026 |
| 80NSSC26P0287SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS | National Aeronautics and Space Administration | $136.0K | Feb 27, 2026 | Jul 3, 2026 |
| 80NSSC26P091580NSSC24PC199 MULTICHIP MODULE PACKAGE FOR SIC PRESSURE SENSORS | National Aeronautics and Space Administration | $60.0K | Nov 18, 2026 | Nov 18, 2026 |
| N0017826P66391003-02 - ATTENUATORS | Department of Defense | $53.2K | Jan 30, 2026 | Jun 5, 2026 |
| 80NSSC24PA494HF2C SIC PRESSURE-TEMPERATURE SENSORS PACKAGING | National Aeronautics and Space Administration | $143.8K | Feb 6, 2024 | Mar 31, 2026 |
| 80NSSC24PB522DRPA SENSOR CHIPS | National Aeronautics and Space Administration | $143.8K | Jun 11, 2024 | Mar 31, 2026 |
| 80NSSC22PA410PACKAGING OF ON-CHIP INTEGRATED SILICON CARBIDE PRESSURE AND MICRO-TC SENSORS | National Aeronautics and Space Administration | $123.0K | Mar 8, 2022 | Jun 30, 2025 |
Upcoming positioning windows
Modeled recompete windows are estimates, not announced solicitations or guarantees.
Registration, certifications & contacts
| Registration evidence | Date |
|---|---|
| SAM updated | Dec 30, 2025 |
| Source loaded | Sep 26, 2026 |
| Initial registration | Mar 22, 2002 |
| Entity start | May 23, 1996 |
Registration classifications: Small Business. These are separate from the reported certificates above.
| Industry | Reported size status |
|---|---|
| 327110 — Pottery, Ceramics, and Plumbing Fixture Manufacturing | Not reported |
| 332117 — Powder Metallurgy Part Manufacturing | Not reported |
| 334419 — Other Electronic Component Manufacturing | Not reported |
| 335932 — Noncurrent-Carrying Wiring Device Manufacturing | Not reported |
| 335999 — All Other Miscellaneous Electrical Equipment and Component Manufacturing | Not reported |
| 336415 — Guided Missile and Space Vehicle Propulsion Unit and Propulsion Unit Parts Manufacturing | Not reported |
| 541330 — Engineering Services | Not reported |
| 541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) | Not reported |
| 927110 — Space Research and Technology | Not reported |
| Contact | Role | Published contact methods | Evidence | Source date |
|---|---|---|---|---|
| ENDER SAVRUN | Government business | Contact method not published | SAM registration | Not available |
| CANAN SAVRUN | Alternate government business | Contact method not published | SAM registration | Not available |
| ENDER SAVRUN | Electronic business | Contact method not published | SAM registration | Not available |
| AMY A GLATT | Alternate electronic business | Contact method not published | SAM registration | Not available |
Registered industries
- 327110 — Pottery, Ceramics, and Plumbing Fixture Manufacturing
- 332117 — Powder Metallurgy Part Manufacturing
- 334419 — Other Electronic Component Manufacturing
- 335932 — Noncurrent-Carrying Wiring Device Manufacturing
- 335999 — All Other Miscellaneous Electrical Equipment and Component Manufacturing
- 336415 — Guided Missile and Space Vehicle Propulsion Unit and Propulsion Unit Parts Manufacturing
- 541330 — Engineering Services
- 541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- 927110 — Space Research and Technology
Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source
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Data coverage and methodology
Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.
No official subaward rows are loaded, so Acorn does not claim known teaming relationships.
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