Federal contract award
80NSSC26P0287
SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | National Aeronautics and Space Administration |
| Office | NASA SHARED SERVICES CENTER |
| NAICS | 541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) |
| PSC | R425 — Engineering and Technical Services |
| Parent award / vehicle | Not reported |
| Set-aside | NO SET ASIDE USED. |
| Pricing type | FIRM FIXED PRICE |
| Obligations | $136.0K |
| Current contract value | $136.0K |
| Potential contract value / ceiling | $136.0K |
| Start date | Feb 27, 2026 |
| Current end date | Jul 3, 2026 |
| Potential end date | Jul 3, 2026 |
| Latest award activity | Jul 31, 2026 |
| Source loaded | Sep 19, 2026 |
Funding and modification history
Showing the latest 2 of 2 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Jul 31, 2026 | P00001 | $0 | SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS |
| Feb 27, 2026 | 0 | $136.0K | SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS |
Research next steps
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.