Federal contract award
80NSSC25PC034
MANUFACTURE PRINTED CIRCUIT BOARDS (PCBS) FOR USE IN THE SIMULATION ENGINEERING BRANCH FOR HARDWARE UPGRADES OF NEXT GENERATION OF SIMULATION COMPUTERS. ASSEMBLE PCBS PER IPC-A-610 CLASS 3 ASSEMBLY STANDARDS
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | National Aeronautics and Space Administration |
| Office | NASA SHARED SERVICES CENTER |
| NAICS | 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing |
| PSC | 7B20 — Hardware, software, and other equipment needed for specialized High Performance Computing (HPC) systems used in solving complex computational problems through massive concurrent use of computing resources and parallel processing techniques. |
| Parent award / vehicle | Not reported |
| Set-aside | SMALL BUSINESS SET ASIDE - TOTAL |
| Pricing type | FIRM FIXED PRICE |
| Obligations | $30.4K |
| Current contract value | $30.4K |
| Potential contract value / ceiling | $30.4K |
| Start date | Sep 25, 2025 |
| Current end date | Sep 30, 2026 |
| Potential end date | Sep 30, 2026 |
| Latest award activity | Jun 10, 2026 |
| Source loaded | Sep 26, 2026 |
Funding and modification history
Showing the latest 4 of 4 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Jun 10, 2026 | P00003 | $0 | MANUFACTURE PRINTED CIRCUIT BOARDS (PCBS) FOR USE IN THE SIMULATION ENGINEERING BRANCH FOR HARDWARE UPGRADES OF NEXT GENERATION OF SIMULATION COMPUTERS. ASSEMBLE PCBS PER IPC-A-610 CLASS 3 ASSEMBLY STANDARDS |
| Feb 5, 2026 | P00002 | $0 | MANUFACTURE PRINTED CIRCUIT BOARDS (PCBS) FOR USE IN THE SIMULATION ENGINEERING BRANCH FOR HARDWARE UPGRADES OF NEXT GENERATION OF SIMULATION COMPUTERS. ASSEMBLE PCBS PER IPC-A-610 CLASS 3 ASSEMBLY STANDARDS |
| Dec 18, 2025 | P00001 | $0 | MANUFACTURE PRINTED CIRCUIT BOARDS (PCBS) FOR USE IN THE SIMULATION ENGINEERING BRANCH FOR HARDWARE UPGRADES OF NEXT GENERATION OF SIMULATION COMPUTERS. ASSEMBLE PCBS PER IPC-A-610 CLASS 3 ASSEMBLY STANDARDS |
| Sep 25, 2025 | 0 | $30.4K | MANUFACTURE PRINTED CIRCUIT BOARDS (PCBS) FOR USE IN THE SIMULATION ENGINEERING BRANCH FOR HARDWARE UPGRADES OF NEXT GENERATION OF SIMULATION COMPUTERS. ASSEMBLE PCBS PER IPC-A-610 CLASS 3 ASSEMBLY STANDARDS |
Buyer contacts from matching notices
Matched on exact award/solicitation identifier and awarding agency. Source dates describe the notice, not current contact verification.
| Contact | Role | Published contact methods | Evidence | Source date |
|---|---|---|---|---|
| Tracy Bremer | Contact | tracy.g.bremer@nasa.gov | Source | Aug 27, 2025 |
| Tracy Bremer | Contact | tracy.g.bremer@nasa.gov | Source | Aug 14, 2025 |
| Tracy Bremer | Contact | tracy.g.bremer@nasa.gov | Source | Aug 8, 2025 |
| Tracy Bremer | Contact | tracy.g.bremer@nasa.gov | Source | Jul 24, 2025 |
| Tracy Bremer | Contact | tracy.g.bremer@nasa.gov | Source | Jul 22, 2025 |
Research next steps
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.