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Federal contractor profile

INTERNATIONAL ELECTRONIC DESIGN GROUP, INC.

UEI N33JEVMSSNB7CAGE 6K9E9Company website ↗

Active
Small Business

Overview

Legal name
INTERNATIONAL ELECTRONIC DESIGN GROUP, INC.
Registered location
SANTA ANA, CA, USA
Website
Company website ↗
Primary NAICS
334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
Latest award activity
Jun 10, 2026
Read company summary

INTERNATIONAL ELECTRONIC DESIGN GROUP, INC. is associated with UEI N33JEVMSSNB7 and CAGE 6K9E9 in public federal records. AcornBids currently links 3 prime awards totaling $71.8K in obligations to this entity. Its largest recorded federal customer by obligations is Department of Defense. Its recorded federal awards include work classified as Printed Circuit Assembly (Electronic Assembly) Manufacturing. These categories describe the loaded award records, not a complete list of company capabilities. Its primary SAM.gov NAICS is 334418 (Printed Circuit Assembly (Electronic Assembly) Manufacturing). Its public SAM.gov registration lists SANTA ANA, CA, USA.

At a glance

Lifetime prime obligations$71.8K
Prime awards3
Awards with future end dates0
Top-agency concentration
Not available

Why this customer concentration

Detailed agency totals are not available in this stored profile.

Largest positive coded-agency total ÷ all positive coded-agency totals × 100

Missing data is shown as unavailable.

Prime contract obligations across loaded award records. Obligations are not revenue or contract ceilings. Summary updated Oct 28, 2026. Refresh pending; these totals may be out of date.

Business information

Public SAM.gov registration details.

Legal name
INTERNATIONAL ELECTRONIC DESIGN GROUP, INC.
UEI
N33JEVMSSNB7
CAGE
6K9E9
Registered address
2630 S SHANNON ST, SANTA ANA, CA, 92704, USA
Registration status
Active
Primary NAICS
334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
SAM activation
May 21, 2026
Initial registration
May 20, 2015
Entity start
Feb 28, 2002
SAM updated
May 21, 2026
Registration expires
May 19, 2027
Fiscal year end
Dec 31
Place of incorporation
CA, USA

View SAM.gov source

Research brief

Source facts

  • Loaded prime-award records link 3 awards and $71,850 in reported obligations to this legal entity. Source
  • Recorded awards include Printed Circuit Assembly (Electronic Assembly) Manufacturing (NAICS 334418); this classification is not proof of every company capability. Source
  • An example award describes: MANUFACTURE PRINTED CIRCUIT BOARDS (PCBS) FOR USE IN THE SIMULATION ENGINEERING BRANCH FOR HARDWARE UPGRADES OF NEXT GENERATION OF SIMULATION COMPUTERS. ASSEMBLE PCBS PER IPC-A-610 CLASS 3 ASSEMBLY STANDARDS Source

Federal award analysis

Net transaction obligations by federal fiscal period.

Selected transaction obligations$71.8K
Prime contracts
$71.8KFY2025$0FY2026

Reported transaction obligations by federal fiscal period; includes deobligations. Missing transactions are not estimated. Histories follow awards currently assigned to this recipient and may include transactions under an earlier recipient. Coverage: 3 of 3 selected awards. Select a period to explore its awards.

Explore funding & geography →View quarterly funding

Recent federal awards

Prime contract awards. Select an award to review its history and source evidence.

Award / descriptionAwarding agencyObligationsStart dateEnd date
80NSSC25PC034MANUFACTURE PRINTED CIRCUIT BOARDS (PCBS) FOR USE IN THE SIMULATION ENGINEERING BRANCH FOR HARDWARE UPGRADES OF NEXT GENERATION OF SIMULATION COMPUTERS. ASSEMBLE PCBS PER…National Aeronautics and Space Administration$30.4KSep 25, 2025Sep 30, 2026
N6660425P0422CIRCUIT CARD ASSEMBLIES FOR MISSION CRITICAL SIMULATOR.Department of Defense$19.9KSep 10, 2025Jun 30, 2026
N0017325P5816FULL TURNKEY CIRCUIT BOARDSDepartment of Defense$21.6KApr 4, 2025May 19, 2025
Explore, filter and export all awards →SubcontractsGrants & subgrants

Registration, certifications & contacts

Registration evidenceDate
SAM updatedMay 21, 2026
Source loadedSep 26, 2026
Initial registrationMay 20, 2015
Entity startFeb 28, 2002

Registration classifications: Self Certified Small Disadvantaged Business, Small Business. These are separate from the reported certificates above.

IndustryReported size status
334412 — Bare Printed Circuit Board ManufacturingNot reported
334418 — Printed Circuit Assembly (Electronic Assembly) ManufacturingNot reported
334419 — Other Electronic Component ManufacturingNot reported
334513 — Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process VariablesNot reported
ContactRolePublished contact methodsEvidenceSource date
EBEN BENADEGovernment businessContact method not publishedSAM registrationNot available
EBEN BENADEElectronic businessContact method not publishedSAM registrationNot available
Registered industries
  • 334412 — Bare Printed Circuit Board Manufacturing
  • 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
  • 334419 — Other Electronic Component Manufacturing
  • 334513 — Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables

Registration classifications and published certificates do not by themselves establish eligibility for a particular solicitation. View SAM source

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Explore the customer, work and award-size evidence behind each match.

ADVANCED ASSEMBLY, LLC

1 shared agency customer(s); Shared work: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
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EMBREE MACHINE INC

1 shared agency customer(s); Shared work: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
1 awards

DAWN VME PRODUCTS

1 shared agency customer(s); Shared work: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
1 awards

GENERAL STANDARDS CORP

1 shared agency customer(s); Shared work: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
2 awards

FLUID PROCESS EQUIPMENT, INC

1 shared agency customer(s); Shared work: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
1 awards

HITECH GLOBAL DISTRIBUTION, LLC

1 shared agency customer(s); Shared work: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing; Average reported award size within 0.5–2× in matching records. Counts and amounts describe sampled matching awards, not the company’s full history.
1 awards

About INTERNATIONAL ELECTRONIC DESIGN GROUP, INC.

What products and services appear in its federal awards?

Recorded award industries: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing.

Recorded products and services: 7B20 — Hardware, software, and other equipment needed for specialized High Performance Computing (HPC) systems used in solving complex computational problems through massive concurrent use of computing resources and parallel processing techniques.; 5998 — Electrical and Electronic Assemblies; Boards, Cards, and Associated Hardware; 5995 — Cable, Cord, and Wire Assemblies: Communication Equipment.

Examples from recent award records:

These records describe federal award work, not every company capability. Review the award evidence.

Where is the company registered?

2630 S SHANNON ST, SANTA ANA, California 92704, United States

Registered location from SAM.gov; award performance locations may differ.

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Data coverage and methodology

Sources: SAM.gov registration, USAspending awards and transactions, and linked supporting records. Prime contract obligations, IDV ceilings and assistance amounts are kept separate. Missing records are not zero activity. Company claims are labeled separately. Recompete signals are rule-based scores out of 100. Positioning windows are AcornBids estimates.

Disclosed relationships only. Missing records do not establish that a contractor has no partners. Ambiguous parent award identifiers are excluded.

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