Federal contract award

HQ072722P0024

RHINESTONE

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Award details

Obligations, current value and potential value describe different measures; they are never added together.

FieldReported value
AgencyDepartment of Defense
OfficeDEFENSE MICROELECTRONICS ACTIVITY
NAICS334412 — Bare Printed Circuit Board Manufacturing
PSC5962 — Microcircuits, Electronic
Parent award / vehicleNot reported
Set-asideNO SET ASIDE USED.
Pricing typeFIRM FIXED PRICE
Obligations$806.0K
Current contract value$806.0K
Potential contract value / ceiling$806.0K
Start dateSep 12, 2022
Current end dateApr 30, 2026
Potential end dateApr 30, 2026
Latest award activityDec 31, 2025
Source loadedSep 19, 2026

Funding and modification history

Showing the latest 4 of 4 loaded transactions. Negative values are deobligations.

DateModificationObligation changeDescription
Dec 31, 2025P00006$0CUSTOM MULTICHIP MODULE DEVICE (RHINESTONE)
Oct 2, 2025P00005$0CUSTOM MULTICHIP MODULE DEVICE (RHINESTONE)
May 28, 2025P00004$528.9KCUSTOM MULTICHIP MODULE DEVICE (RHINESTONE)
Dec 5, 2024P00003$0CUSTOM RHINESTONE CIRCUIT DESIGN OVERMOLDED MULTI-CHIP MODULE (MCM) DEVICES. EXTENDS DELIVERY DATE FOR OPTION CLINS.

Buyer contacts from matching notices

Matched on exact award/solicitation identifier and awarding agency. Source dates describe the notice, not current contact verification.

ContactRolePublished contact methodsEvidenceSource date
Zonel LabordeContactzonel.laborde.civ@mail.milSourceJul 12, 2022
Zonel LabordeContactzonel.laborde.civ@mail.milSourceJul 5, 2022
Zonel LabordeContactzonel.laborde.civ@mail.milSourceJun 29, 2022

Research next steps

  1. Check the stated set-aside against the solicitation and current certifications.
  2. Review the award scope and buyer evidence before making a bid/no-bid decision.