Federal contract award
N0017325P0063
TO PROCURE THE INDUCTIVELY COUPLED PLASMA (ICP) DEEP REACTIVE ION ETCHING (DRIE) TOOL TO INCLUDE ALL OF THE REQUIRED SPECIFICATIONS FOUND IN ATTACHMENT 1.
Award details
Obligations, current value and potential value describe different measures; they are never added together.
| Field | Reported value |
|---|---|
| Agency | Department of Defense |
| Office | NAVAL RESEARCH LABORATORY |
| NAICS | 333242 — Semiconductor Machinery Manufacturing |
| PSC | 3670 — Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery |
| Parent award / vehicle | Not reported |
| Set-aside | NO SET ASIDE USED. |
| Pricing type | FIRM FIXED PRICE |
| Obligations | $687.9K |
| Current contract value | $687.9K |
| Potential contract value / ceiling | $687.9K |
| Start date | Sep 25, 2025 |
| Current end date | Jul 2, 2026 |
| Potential end date | Jul 2, 2026 |
| Latest award activity | Dec 15, 2025 |
| Source loaded | Sep 19, 2026 |
Funding and modification history
Showing the latest 2 of 2 loaded transactions. Negative values are deobligations.
| Date | Modification | Obligation change | Description |
|---|---|---|---|
| Dec 15, 2025 | P00001 | $0 | TO PROCURE THE INDUCTIVELY COUPLED PLASMA (ICP) DEEP REACTIVE ION ETCHING (DRIE) TOOL TO INCLUDE ALL OF THE REQUIRED SPECIFICATIONS FOUND IN ATTACHMENT 1. |
| Sep 25, 2025 | 0 | $687.9K | TO PROCURE THE INDUCTIVELY COUPLED PLASMA (ICP) DEEP REACTIVE ION ETCHING (DRIE) TOOL TO INCLUDE ALL OF THE REQUIRED SPECIFICATIONS FOUND IN ATTACHMENT 1. |
Research next steps
- Check the stated set-aside against the solicitation and current certifications.
- Review the award scope and buyer evidence before making a bid/no-bid decision.