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Date filters select awards with transaction activity in the period. Amounts below are lifetime award obligations. IDV values remain separate.
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PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS AND/OR OPERATE…Department of Defense$502.0K obligationsEnds Dec 18, 2026
CAPRE FIMLA/PIMLA 25-5E4Department of Defense$992.7K obligationsEnds May 31, 2026
CIRCUIT CARD ASSEMBLIESDepartment of Defense$1.8M obligationsEnds Mar 27, 2026
PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.Department of Defense$12.9K obligationsEnds Apr 30, 2026
MICROELECTRONIC SYSTEMS INTEGRATION: INITIAL TASK ORDER MINIMUM GUARANTEEDRMM V2Department of Defense$2.5K obligationsEnds Apr 4, 2026
PRINTED CIRCUIT BOARDS TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS.Department of Defense$103.5K obligationsEnds Dec 31, 2025
IUADP HARDWARE ASSEMBLYDepartment of Defense$1.7M obligationsEnds Jun 3, 2026
FMS - J-6594A/A IUADP HARDWARE ASSEMBLYDepartment of Defense$1.4M obligationsEnds Jan 19, 2024
MINIMUM OBLIGATION OF FUNDSDepartment of Defense$0 obligationsEnds Feb 12, 2025